Overview of Silvaco TCAD 2024
Silvaco TCAD 2024 (Baseline Release) is the latest iteration of Silvaco’s comprehensive Technology Computer-Aided Design (TCAD) software suite, developed by Silvaco Group, Inc. (NASDAQ: SVCO), a provider of TCAD, EDA, and SIP solutions for semiconductor design and digital twin modeling. Released in early 2024 with major expansions announced on September 24, 2024, it enables process and device simulation for advanced semiconductor technologies, dramatically reducing development costs and time to market. The suite, centered on the Victory platform, supports visualization of internal device physics, virtual experimentation, and AI-driven optimization, making it essential for industries like power devices, displays, optoelectronics, memory, foundry, automotive, and emerging areas such as 5G, AI, and high-performance computing.
Key to its value is the integration of physical simulations with experimental data for fab technology co-optimization (FTCO) and design technology co-optimization (DTCO), allowing users to “see inside” devices, test theories, and communicate performance improvements clearly. As of October 14, 2025, the 2024 Baseline remains the current major release, with ongoing quarterly updates and strong adoption evidenced by 46 new customers in 2024 and expansions in key markets.
Key Features
- Process Simulation: Models implantation, diffusion, oxidation, etch, deposition, epitaxy, photolithography, and stress effects for realistic fab emulation.
- Device Simulation and Meshing: 2D/3D device modeling with Victory Mesh for accurate re-meshing; supports drift-diffusion physics, DC/AC/transient analysis, and mixed-mode TCAD-SPICE co-simulation.
- Advanced Physics: Atomic-scale transport, optical-electrical coupling, and small-signal noise analysis (e.g., impedance field methods).
- Optimization and Analytics: Design of Experiments (DoE), machine learning-based calibration, and interactive tools for multi-scale process integration.
- Digital Twin and FTCO/DTCO: AI/ML-enhanced virtual wafer fab for predictive modeling, yield improvement, and circuit-level optimization across layout, process, and extraction domains.
- Visualization and Extraction: High-fidelity 3D rendering, RC extraction, and SPICE parameter generation for downstream EDA flows.
- Parallel Computing: High-performance solvers for large-scale simulations, including cryogenic applications for quantum and advanced nodes.
