Keysight IC-CAP 2025 represents the cutting edge in semiconductor device characterization and modeling software, providing engineers with unparalleled capabilities for extracting accurate SPICE model parameters from measurement data. As semiconductor technology pushes beyond 3nm nodes and into advanced materials like GaN, SiC, and 2D materials, IC-CAP 2025 delivers the sophisticated tools needed to create reliable, production-ready models for circuit simulation and design success.
Transformative Features in Keysight IC-CAP 2025
1. Next-Generation Device Modeling for Advanced Technologies
-
AI-Enhanced Parameter Extraction: Machine learning algorithms accelerate and improve the accuracy of complex parameter extraction processes for FinFET, GAA (Gate-All-Around), and emerging device architectures
-
Quantum-Accurate Compact Modeling: Advanced physics-based models accounting for quantum mechanical effects in ultra-scaled devices and novel material systems
-
Multi-Physics Reliability Modeling: Comprehensive aging, HCI (Hot Carrier Injection), and BTI (Bias Temperature Instability) analysis with predictive degradation modeling
2. Enhanced Measurement Integration & Automation
-
Unified Instrument Control Framework: Seamless integration with Keysight and third-party measurement systems including B1500A, E5270B, and latest PXI-based solutions
-
Smart Measurement Sequencing: Adaptive measurement algorithms that optimize data collection based on device response and characterization goals
-
Cloud-Enabled Distributed Measurement: Support for remote and distributed characterization setups with real-time data synchronization and analysis
3. Advanced Model Development & Validation
-
Hierarchical Model Development: Enhanced tools for developing and validating complex hierarchical models including RF, noise, and thermal-aware models
-
Statistical Model Generation: Improved Monte Carlo and process corner model generation with advanced statistical analysis capabilities
-
Model-to-Hardware Correlation: Advanced validation tools ensuring models accurately predict silicon performance across corners and temperatures
4. Specialized Technology Modules
-
Power Device Modeling Suite: Comprehensive tools for GaN, SiC, and advanced power device characterization including dynamic RDS(on), switching loss, and avalanche ruggedness
-
RF/mmWave Modeling Package: Enhanced capabilities for modeling devices up to THz frequencies with accurate parasitic extraction and EM-corrected models
-
Memory Device Characterization: Specialized tools for emerging memory technologies including MRAM, ReRAM, and advanced NAND/NOR flash characterization
