Cadence Integrity 3D-IC 2025: The Unified Platform for Next-Generation Heterogeneous Integration
Cadence Integrity 3D-IC 2025 is the industry-leading electronic design automation (EDA) platform specifically architected for the complexities of designing modern three-dimensional integrated circuits (3D-ICs) and multi-chiplet systems. It provides a cohesive, start-to-finish environment that unifies system-level planning, physical implementation, and signoff analysis—a critical requirement for managing the interdependencies of power, performance, thermal, and cost in advanced packaging.
Core Functionality & Key Features:
1. System-Level Planning & Architecture Exploration
This module enables early-stage decision-making, which is crucial for cost and performance.
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Chiplet Partitioning & Stacking Exploration: Allows architects to evaluate different die partitioning schemes, 2.5D/3D stacking options, and interposer configurations to optimize for performance, power, and manufacturability.
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System Performance & Cost Modeling: Provides fast, high-level models to analyze the performance impact of interconnect bandwidth and latency, as well as estimated cost based on technology nodes and packaging choices.
2. Physical Implementation & Co-Design
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Unified Multi-Die Floorplanning: Manages the complex placement of multiple chiplets and dies within a package, considering through-silicon vias (TSVs), micro-bumps, and interposer routing.
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Advanced Packaging Support: Provides dedicated tools for designing and verifying silicon interposers, organic substrates, and RDL layers, ensuring a seamless path from chip to package.
3. Integrated Multi-Physics Analysis & Signoff
This is where the platform ensures the design will work in the real world.
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Thermal Analysis & Management: Performs critical electro-thermal and thermal stress analysis to identify hotspots in 3D stacks and guide the placement of thermal bumps or TSVs for effective heat dissipation.
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Power Integrity & Signal Integrity Analysis: Analyzes power delivery network (PDN) performance and signal quality across the entire multi-die system, from one die through the package to another.
4. Design for Test (DFT) & System-Level Verification
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Unified DFT Planning: Addresses the unique test challenges of 3D-ICs, planning for pre-bond and post-bond testing of individual dies and the complete stacked system.
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System-Level LVS & DRC: Extracts and verifies the netlist from the entire 3D assembly and performs design rule checks that span across dies and the package, ensuring connectivity and manufacturability.
