Solve Complex Electronics Cooling Challenges with Confidence and Speed

6sigmaDC v17 is the latest release of the industry-leading Computational Fluid Dynamics (CFD) solution dedicated to electronics thermal management. Developed by Future Facilities, this powerful software empowers engineers to predict and optimize the thermal performance of their designs—from single PCBs to entire data centers—before physical prototyping. With v17’s focus on modeling speed, automation, and multi-physics accuracy, you can eliminate overheating risks, enhance product reliability, and accelerate time-to-market.

Key Innovations & Capabilities in Version 17

6sigmaDC v17 introduces groundbreaking features that streamline the entire thermal analysis workflow, making high-fidelity simulation more accessible and efficient than ever.

1. Unmatched Modeling Speed & Automation

Dramatically reduce model preparation time from days to minutes.

  • Intelligent Model Builder (IMB): Automatically generates detailed thermal models directly from standard EDA (e.g., ODB++, IDF) and mechanical CAD (e.g., STEP) files, preserving critical geometric and material details.

  • Advanced Meshing Algorithms: Experience faster and more robust automatic meshing for even the most complex geometries, reducing solver setup time and improving convergence.

  • Template & Scripting Support: Automate repetitive tasks and standardize simulation processes across your organization using powerful scripting tools.

2. High-Fidelity Multi-Scale Analysis

Seamlessly analyze components at every level, from chip to data center.

  • Unified Workflow: Model a single component on a PCB, the entire board in an enclosure, or the enclosure in a server rack within the same project, ensuring consistent and accurate results across all scales.

  • Advanced Compact Modeling: Accurately represent complex components like chips, packages, and heat sinks using detailed dual-resistor network models (DELPHI, Two-Resistor) for precise junction temperature prediction.

  • Conjugate Heat Transfer: Solve coupled fluid flow and heat transfer problems with high accuracy, capturing effects like conduction, convection, and radiation.

3. Enhanced Data Center Specific Capabilities

Specialized tools for optimizing the thermal performance and efficiency of critical facilities.

  • Dynamic Energy Optimization: Model and analyze the impact of IT load changes, cooling setpoints, and airflow management strategies on overall data center PUE (Power Usage Effectiveness).

  • Rack “What-If” Scenarios: Quickly evaluate the thermal impact of adding, removing, or reconfiguring IT equipment within a rack.

  • CRAC/CRAH Unit Modeling: Accurately represent the performance of computer room air conditioning units and their interaction with the room environment.

4. Powerful Results Visualization & Insight

Move beyond simple temperature plots to gain deep engineering insight.

  • Interactive 3D Results Visualization: Explore temperature, airflow, and pressure fields with intuitive cutting planes, isosurfaces, and particle traces.

  • Advanced Reporting Tools: Automatically generate comprehensive, customizable reports with key performance metrics (e.g., junction temperatures, flow rates, PUE) for stakeholders.

  • Design Comparison Dashboard: Easily compare the results of multiple design iterations side-by-side to make informed decisions quickly.