advanced-packaging

Electrical & Power Engineering

Coventor SEMulator3D 11.2

Coventor SEMulator3D 11.2: The Definitive Platform for 3D Semiconductor Virtual Fabrication Coventor SEMulator3D 11.2 is the industry-leading software solution for virtual fabrication and predictive process modeling of the world’s most advanced 3D semiconductor devices and advanced packaging architectures. As part...
Electrical & Power Engineering

Cadence Integrity 3D-IC 2025

Cadence Integrity 3D-IC 2025: The Unified Platform for Next-Generation Heterogeneous Integration Cadence Integrity 3D-IC 2025 is the industry-leading electronic design automation (EDA) platform specifically architected for the complexities of designing modern three-dimensional integrated circuits (3D-ICs) and multi-chiplet systems. It provides...